Fuel tank resistor card having improved corrosion resistance

ABSTRACT

A resistor card for a fuel level sensor has improved resistance to corrosion and wear. The resistor card has a substrate with a resistive layer and a conductive layer. A nickel layer covers the conductive layer. A nickel-gold alloy layer covers the nickel layer. The nickel-gold alloy layer protects the conductive layer from sulfur corrosion and improves wear resistance.

CROSS REFERENCE TO RELATED AND CO-PENDING APPLICATIONS

The present application is a division of U.S. patent application Ser.No. 10/406,356, filed on Apr. 3, 2003 and entitled, “Fuel Tank ResistorCard Having Improved Corrosion Resistance”. The contents of which areherein incorporated by reference in entirety.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to variable resistors and in particular toa ceramic resistor card for use in a fuel level sensor that is lower incost and has improved resistance to sulfur corrosion.

2. Description of the Related Art

Variable resistors are known for sensing parameters in a variety ofapplications. For example, the fuel level in an automobile tank istypically measured using a variable resistor having a sweep armmechanically or electrically coupled to a float located in a fuel tank.The sweep arm position varies according to the float level. The positionof the sweep arm can be detected by measuring the voltage across thevariable resistor. Therefore, the voltage detected across the variableresistor is an indication of fuel level.

Examples of such fuel sensors are disclosed in the following U.S. Pat.Nos.: 5,746,088, 6,021,668, 6,127,916, 6,212,950 and U.S. Patentpublication number 2002/0040597.

Variable resistors used for fuel level measurement are typically a cardwith metalized conductor areas and thick film resistive ink. The thickfilm ink is deposited in precise areas to interconnect specificmetallized areas. A sweep arm is pivotally mounted to the patterned cardand includes a wiper blade like assembly with contact fingers. As thefloat raises and lowers according to the fluid level, the wiper contactfingers move along the resistor card in an arcuate path and make contactwith the metalized areas. This results in a voltage change thatgenerates a signal representative of the amount of fuel contained in thetank.

One problem with this type of system is that over the life of a vehiclethe assembly must go through thousands of cycles in a harsh environment.The card is exposed to both wet and dry conditions as the fluid level isdecreased. In addition, the assembly is exposed to severe vibrationresulting from vehicle movement. Wear occurs as the wiper contactfingers go back and forth over the metalizations. The electricalresistance of the metalization portions may increase and cause accuracyproblems with the fuel reading. Additionally, the metalized portions maywear to the point that an open circuit is created on the card.

The resistor card is manufactured by using a ceramic substrate that isscreen printed with conductive and resistive inks and fired at hightemperatures in a furnace. Conductive inks used in the manufacturing ofthe ceramic card contain both various metals and binders. Metals used inthe conductive inks include silver, platinum, palladium, gold, copper,as well as others. Silver is desired for conductive properties, low costand the ease with which electrical wires can be soldered to thesubstrate. Other metals such as palladium are used in the ink to providestrength against shear forces exerted by the sliding contacts andcorrosion resistance. A commonly used conductor is 2.3 parts silver to 1part palladium by weight.

Silver has many desirable properties as a conductor. Unfortunately,silver is also chemically reactive to compounds found in fuels. Forexample, sulfur in fuel can attack silver to form various compounds suchas silver sulfide (Ag2S), which are non-conductive. These deposits ofnonconductive material generate contact resistance and create shiftsand/or spikes in the output signal of the fuel sensor. This increasedcontact resistance may appear as signal “noise” where the output“spikes” momentarily from the proper reading.

One method to improve the corrosion resistance of the resistor card isto increase the amount of gold, palladium or platinum used in theconductive metallization and decrease the amount of silver.Unfortunately, the cost of gold, palladium and platinum is about 100times greater than the cost of silver. This results in a resistor cardthat is prohibitively expensive.

A current unmet need exists for a fuel tank resistor card that is bothresistant to chemical attack and corrosion and that is cost effective tomanufacture.

SUMMARY OF THE INVENTION

It is a feature of the present invention to provide a resistor card fora fuel level sensor that has improved resistance to corrosion and wear.

It is a feature of the present invention to provide a resistor card fora fuel level indicator system. The resistor card has a substrate thathas a first and a second surface. A resistive layer is disposed on thefirst surface. A conductive layer is disposed on the first surface. Anickel layer covers the conductive layer. An alloy layer covers thenickel layer. The alloy layer protects the conductive layer fromcorrosion.

Another feature of the present invention is to provide a resistor cardfor a fuel sensor. The resistor card has a ceramic substrate with afirst and second surface. A resistive path is located on the firstsurface. A conductive path is located on the first surface. A barrierlayer is located over the conductive path. The barrier layer seals theconductive path from corrosion. An electroplated alloy layer is locatedover the barrier layer. The alloy layer provides a long lasting wearsurface.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a top view of a resistor card and wiper with a portion of thecontact portion broken away.

FIG. 2 is a top view of the resistor card of FIG. 1 showing the completecontact pattern.

FIG. 3 is a simplified side view of a portion of the resistor card ofFIG. 1 in contact with a wiper arm.

FIG. 4 is a simplified enlarged cross-sectional view of a portion of aconductor of FIG. 1.

FIG. 5 is a flow chart of a process for manufacturing the resistor cardof FIG. 1.

FIG. 6 is a table of compositions for the alloy layer of the presentinvention.

It is noted that the drawings of the invention are not to scale. In thedrawings, like numbering represents like elements between the drawings.

DETAILED DESCRIPTION

Referring to FIGS. 14, a fuel level detecting system or sensor 10 isshown. Fuel sensor 10 includes a ceramic resistor card or substrate 12that is patterned with resistive 31 and conductive 37 paths that areadapted to contact a wiper blade 20. Wiper blade 20 is coupled to apivoting wiper linkage and a fuel tank float (not shown). Wiper blade 20has two wiper arms 25. Each arm 25 has conductive fingers 21 and 23, and22 and 24, which are parallel to each other. Wiper blade 20 ispreferably formed from a metal alloy of palladium.

A ceramic substrate 12 is the base for mounting resistive and conductivepaths or traces. Substrate 12 has a top surface 12A and a bottom surface12B. An arc-shaped resistor path 31 and an arc-shaped continuousconductor path 37 are located on surface 12A. The resistor path 31includes a resistor trace 30 that is located on top of a portion of aconductor line 27 to form a generally arc shaped resistive path 31. Theresistor trace 30 overlays a portion of fingers 27. The resistor trace30 is covered by a glass encapsulant 40. Conductor base 28 forms agenerally arc shaped conductor path 37. Fingers 22 and 24 are positionedto contact conductor lines 27 and fingers 21 and 23 are positioned tocontact conductor base 28 as the wiper blade 20 moves. The conductorsare formed from a thick film conductor material that is a mixture offine metal particles and a glass frit. The metal particles are in aratio of 1 part platinum and 99 parts silver. The high ratio of silvergives the conductor very low resistance.

In the fuel tank, as the float rises and lowers the wiper blade 20arcuately travels across conductor line 27 and conductor base 28. Themoving wiper blade 20 is designed and oriented to have amake-before-break operation, in which the sweeping fingers, i.e. 22 and24 in FIG. 1, make connection with successive adjacent conductor lines38 before breaking contact with a currently contacted conductor line 36.

Probe pads 52 may be located on substrate 12 for testing duringmanufacturing. Buss bar 54 connects the conductor base 28 to a terminalpad 56. A wire (not shown) would be soldered to terminal pad 56 in orderto make an electrical connection to the resistor card. Similarly, a bussbar 55 connects the resistor trace 30 to another terminal 56. A secondresistor 60 can be placed in series with the resistor trace 30. Resistor60 would be laser trimmed during manufacturing in order to adjust theoverall resistance of the resistor card. Resistor 60 is covered by aglass encapsulant 40. Buss bars 58 are connected to resistor 30 andconductor 28 in order to facilitate the electroplating operation duringmanufacturing.

Referring to FIG. 4, an enlarged cross-sectional view of a conductorline 36 is shown. Conductor line 36 has a conductive layer 36A or coreof silver-platinum that is located on surface 12A. A first nickel strikelayer 36B covers the conductive layer 36A. A second electroless nickellayer 36C covers layer 36B. Layer 36B and 36C form a barrier layer. Analloy layer 36D covers nickel layer 36C. Metal finger 22 is infrictional contact with layer 36D. Alloy layer 36D is preferably anickel-gold-alloy. Alloy layer 36D can also be formed from other alloyssuch as cobalt-gold, palladium-nickel, palladium-cobalt,platinum-cobalt, platinum-nickel, platinum-iridium, palladium-rutheniumand platinum-ruthenium. Examples of some possible alloys that could beused are shown in FIG. 6.

It is noted that each layer completely covers the layer below. It isfurther noted that FIG. 4 is not to scale. The thickness of platedlayers 36B, C and D is much less than the thickness of the thick filmlayer 36A. Each layer in FIG. 4 serves a particular purpose. Forexample, the thick film conductor layer 36A provides good adhesion tosubstrate 12 and has the cross-sectional area needed to conduct therequired current. Nickel strike layer 36B seals the thick film layer 36Ato prevent silver contamination of the plating bath used for nickellayer 36C. Electroless nickel layer 36C further seals layer 36B andprovides a base with good adhesion for nickel-gold alloy layer 36D. Thenickel-gold alloy layer 36D provides a corrosion resistant layer. Layer36D also provides a hardened gold layer that-has good mechanical wearresistance when wiper 25 slides across layer 36D during operation of thefuel sensor. Nickel-gold alloy layer 36D may be used in conjunction witha lubricant or a lubricant may be omitted.

The nickel-gold alloy layer 36D is preferably formed from EnthoneAutronex plating bath that is commercially available from EnthoneCorporation of West Haven, Conn. The nickel-gold alloy layer 36D has apreferred composition of 0.3 weight % to 4.0 weight % nickel and 96.0weight % to 99.7 weight % gold based on total composition.

EXAMPLE 1

A resistor card was fabricated according to the present invention. Analuminum oxide substrate was used. Layers 36A, 36B, 36C and 36D wereformed from the following materials: Conductive layer 36A 97.0 wt. %silver/1.0 wt. % platinum/2.0 wt. % glass. First nickel strike layer 36B100 wt. % nickel. Second electroless nickel 100 wt. % nickel. layer 36CAlloy layer 36D 1.0 wt. % nickel/99.0 wt. % gold

The resistor card of example 1 was tested for several performanceparameters. The card was mated with a palladium alloy wiper and drycycled for 1 million cycles. Visual inspection of the wear surfaces onthe gold alloy showed very little wear of the alloy layer and none ofthe underlying nickel layer was exposed. The card was tested for noiseperformance. Noise performance was tested by cycling the wiper with a 5volt applied voltage while measuring the output voltage. The resistorcard of example 1 showed no noise spikes greater than 0.15 Volts after 1million cycles. In-comparison, a resistor card prepared with apalladium-silver thick film was tested for 660,000 cycles. Noise spikesgreater than 0.7 Volts were present. A resistor card with pure goldplating was also tested for noise performance. After 1 million cycles,noise spikes of greater than 1.5 volts were present and some of theunderlying nickel layer was exposed.

The resistor card was tested for surface roughness. The surfaceroughness was measured with a laser profilometer. The surface roughnessfor the nickel-gold alloy layer was 0.46 Ra. In comparison, thepalladium-silver thick film had a larger value of surface roughness of0.58.

Assembly Process

The process 100 for manufacturing resistor card 12 is shown in FIG. 5.At step 102, a platinum-silver thick film conductor having a metal ratioof 99 parts silver to 1 part platinum by weight such as Dupont 5426 isscreen printed onto an aluminum oxide substrate to form the pattern ofconductive lines, buss bars and terminals. The substrate can be a singleresistor card or can be a multi-piece substrate that contains severalresistor cards that are processed at the same time and then areseparated later. Other thick film conductors can be used such asmixtures of palladium, silver and gold. The conductors are then fired atstep 104 in a standard thick film furnace at 850 degrees centigrade for5 to 10 minutes. Next, at step 106, a resistor thick film ink such asDupont QS is screen printed onto the substrate to form the resistors.The resistors are then fired at step 108 in a standard thick filmfurnace at 850 degrees centigrade for 5 to 10 minutes. At step 110, aglass encapsulant such as Dupont 5415A is screen printed over theresistor 30 and 60. The encapsulant is then fired at step 112 in astandard thick film furnace at 610 degrees centigrade for 5 to 10minutes. The encapsulant prevents the resistors from being electroplatedduring subsequent processing.

At step 114, an electrolytic nickel strike plate is deposited onto theconductors. The resistor card is placed into a plating bath of Enthonenickel sulfamate strike and plated for 2 minutes at 118 degrees F and 20amps per square foot. The card is then rinsed in de-ionized water afterplating. The strike plate covers the silver thick film to prevent silvercontamination in later plating baths. Next, at step 116, an electrolessnickel plating is deposited over the electrolytic nickel. The resistorcard is placed into a plating bath of Enthone Enplate 434 for 10 minutesat 190 degrees F. The resulting nickel plating has a thickness of100-250 micro inches. The card is then rinsed in de-ionized water afterplating. At step 118, the card is plated with a hard nickel-gold alloy.The resistor card is placed into a plating bath of Enthone Autronex(0.3% to 4% Ni) for 10 minutes at 92 degrees F and 10 amps per squarefoot. The resulting nickel-gold plating has a thickness of 25-75 microinches. The card is then rinsed in de-ionized water. At step 120, theresistor 60 is laser trimmed to adjust the overall resistance value.Buss bars 58 are also disconnected at this step from conductors 28 andresistor 30.

Next, the ceramic card is singulated into individual parts at step 122then electrical tested and packaged at step 124.

Remarks

One of ordinary skill in the art of designing and using fuel levelsensors will realize many advantages from using the present invention.The use of the nickel-gold plating prevents a silver rich thick filmconductor from corrosion due to sulfur in the fuel. The nickel-goldplating being fairly thin in relation to the thick film conductor allowsa much less costly solution to preventing corrosion in comparison tousing a thick film that is composed of more noble metals such as gold,palladium and platinum. With the noble metals costing on the order of100 times the cost of silver, the cost savings of not using these thickfilm conductors are quite significant.

An additional advantage of the present invention is reduced noise. Theuse of the nickel-gold plating prevents the formation of nonconductivematerials such as Silver Sulfide (AgS). The non-conductive materialchanges the contact resistance that can appear as signal “noise” in theoutput of the ceramic resistor card.

The present invention does not have exposed silver that is available forinteraction with sulfides in the fuel. It has very good oxidation andcorrosion resistance and wear resistance. The present invention has lowbuss resistance and low contact resistance. The gold alloy platingallows for good solderability of wires to the terminals.

It is noted that the preferred embodiment used a glass encapsulant toprevent the resistor from being plating during the later platingoperations. Other materials and processes could also be used. Forexample, a polymeric photoresist could be used that is imaged byphotolithography or a screenable polymeric photoresist could be used.

It is noted that the preferred embodiment used a nickel-gold alloy asthe outer most layer. Other plated alloys could also be used. FIG. 6shows other alloys that could be used. For example, the following alloycompositions based on total weight percent composition could also beused:

-   -   1. 0.1 to 0.3% cobalt and 99.7 to 99.9% gold;    -   2. 15.0% to 25.0% nickel and 85.0% to 75.0% palladium;    -   3. 15.0% to 25.0% cobalt and 85.0% to 75.0% palladium.

The use of gold plating carries the concern of durability due to thehigh number of rotations required of a rheostat fuel sensor. Pure goldby itself is a very soft material. Pure gold has a hardness of 60-85Knoop. As seen from FIG. 6, this is much less than the alloys shown. Forexample, the nickel-gold alloys shown have a hardness of 120-300 Knoop.The following table indicates the relative hardness of various materialswith respect to that of a Palladium-Silver (Pd—Ag) thick film. GoldPlating  25% of Pd—Ag hardness Nickel-Gold Alloy Plating  75% of Pd—Aghardness Platinum-Palladium-Gold Thick Film 115% of Pd—Ag hardnessPalladium-Nickel Alloy Plating 200% of Pd—Ag hardness

The surface roughness and topography can also reduce durability of thesensor system by causing excessive wear of the wiper as it moves acrossthe conductors. The hardened nickel-gold plating offers the followingbenefits;

-   -   The surface roughness of the thick film conductor is reduced by        20%.    -   The effects of the glass frit that are contained in thick film        conductors are eliminated because the glass is no longer present        on the surface.    -   The reduction in abrasion on the conductor surface results in        less residue from contactor wear.    -   The nickel-gold plating fully covers the contacting surface.

The reduced surface roughness along with a 100% metallized surfaceallows for a greater selection of wiper materials. The lower abrasioncharacteristics of the nickel-gold plating can allow softer silver freecontact materials to be used because higher contact gram force is nolonger required to remove the tarnish between the wiper and theconductive traces.

The silver thick film conductor material of the present invention has 10times greater conductivity than that of other noble metal thick filmconductors. The lower sheet resistance will enable narrower and longerterminating traces while still meeting low-ohm buss resistancerequirements. This will be particularly useful as rheostat designs getmore complicated or utilize more of the ceramic real estate.

The present invention also greatly improves contact resistance. ThePd—Ag thick film conductors of the prior art have several problems. Thethick film composition is a mixture of glass and Pd—Ag alloy powder.After high temperature firing, the surface of the conductor will havesome glass exposure on the surface as well as oxidation of the metalalloy. Both of these components generate contact resistance. Thenickel-gold plated conductors of the present invention are free ofsurface oxides. The lack of oxidation results in excellent electricalconductivity and low contact resistance.

The nickel-gold plated terminals are easily soldered. A burnishing stepis not required to achieve solder coverage and wetting. The gold alloyplating allows for a long storage life prior to soldering.

While the invention has been taught with specific reference to theseembodiments, someone skilled in the art will recognize that changes canbe made in form and detail without departing from the spirit and thescope of the invention. The described embodiments are to be consideredin all respects only as illustrative and not restrictive. The scope ofthe invention is, therefore, indicated by the appended claims ratherthan by the foregoing description. All changes which come within themeaning and range of equivalency of the claims are to be embraced withintheir scope.

1. A resistor card for a fuel level indicator system, comprising: aplanar ceramic substrate having a first and second surface; a resistivearea disposed on the first surface; a thick film conductive areadisposed on the first surface, the conductive area in electrical contactwith the resistive area, the conductive area having a composition basedon total composition that is greater than 50 weight percent silver; aglass encapsulant covering the resistive area; and an electroplatedcobalt and palladium alloy layer covering the conductive area such thatthe conductive area is protected from corrosion, the cobalt andpalladium alloy layer having a composition based on total compositioncomprising 15.0 to 25.0 weight percent cobalt and 75.0 to 85.0 weightpercent palladium.
 2. The resistor card according to claim 1, wherein anickel layer is disposed between the conductive area and theelectroplated cobalt and palladium alloy layer.
 3. A resistor card for afuel level indicator system, comprising: a planar ceramic substratehaving a first and second surface; a resistor located on the firstsurface; a plurality of conductive lines, the conductive lines having anend extending under the resistor and another end extending way from theresistor, the conductive lines in electrical contact with the resistor,the conductive lines having a composition based on total compositionthat is greater than 50 weight percent silver; a glass encapsulantcovering the resistor; and an electroplated cobalt and palladium alloylayer covering the end of the conductive lines such that the conductivelines are protected from corrosion, the cobalt and palladium alloy layerhaving a composition based on total composition comprising 15.0 to 25.0weight percent cobalt and 75.0 to 85.0 weight percent palladium.
 4. Theresistor card according to claim 3, wherein a nickel layer is disposedbetween the conductive lines and the electroplated cobalt and palladiumalloy layer.